Automatic inspection and control of semiconductors

High-precision inline automatic X-ray inspection system for the quality control of flip-chip assemblies and semiconductors, ensuring fast, reliable and reproducible defect detection during production.

A fast, hi-resolution automatic X-ray inspection system using laminography for the quality control of electronic components and semiconductors

The Rigaku XTRAIA MF-3000 (formerly MFM310) performs high-precision measurements not possible by optical or ultrasonic techniques.

The Rigaku ONYX 3200 is an automated system for high-sensitivity metal contamination detection using grazing incidence technology.

The TXRF-V310 is a high-throughput TXRF spectrometer with integrated VPD, delivering ultra-sensitive, automated metal contamination analysis across the entire wafer surface.

Automatic metal contaminant detection system using grazing incidence

Automatic thin film composition and crystallinity detection system

WaferLine is a fully automated ultrasonic wafer inspection system, delivering reliable and repeatable defect detection across the entire inspection process.

High definition CT X-ray Inspection System, designed for non-destructive testing of the most advanced electronic and semiconductor components. With an exceptional resolution of up to 0.16 µm, it enables detailed analysis of internal structures in both 2D and 3D.